Lierda BT18N Module
Introduzzjoni
BT18N is a low-power, high-performance IoT Bluetooth, 802.15.4, andproprietary2.4G protocol module, supporting BLE 6.0, 802.15.4-2020, and up to 4 Mbps proprietary2.4 GHz mode. The module adopts a stamp-type package with onboard PCBantennadesign. The product also features low power consumption, small size, rich resources,strong anti-interference capability, and other characteristics
Speċifikazzjonijiet
| Oġġett | Speċifikazzjoni |
|---|---|
| Mudell tal-modulu | BT18N |
| Faxxa tal-frekwenza tax-xogħol | Banda ISM 2.4 GHz |
| Antenna | Antenna tal-PCB abbord |
| Dimensjonijiet | 19 mm × 12.9 mm × 3 mm |
| Vol operattivtage | 1.7 V to 3.6 V (typical 3.3 V) |
| Kurrent tat-tnedija | 5 mA @ 0 dBm (3.3 V typical) |
| Transmit power (range) | -46 dBm sa +8 dBm |
| Irċievi kurrenti | 3.2 mA @ 1 Mbps (3.3 V typical) |
| Kurrent standby | 0.6 µA @ 3.3 V typical |
| Temperatura operattiva | -40 °C sa +105 °C |
| Temperatura tal-ħażna | -40 °C sa +125 °C |
| Interface tal-komunikazzjoni | UART; Internal storage: 1524 KB RRAM + 256 KB RAM |
Setup ta 'malajr
- Connect the module’s VCC pin (pin 10) to an external supply in the range 1.7 V to 3.6 V (typical 3.3 V).
- Place decoupling capacitors (recommended 10 µF and 0.1 µF) as close as possible to the VCC power pin.
- Provide proper reset handling: nRST is internally configurable with a typical 14 k pull-up resistor; the reset line should not be too long and should be kept away from RF/VCC and strong interference sources.
- For SWD debugging/firmware burning, connect to SWDCLK (pin 13) and SWDIO (pin 14); modules can be directly connected using Jlink.
- When using the onboard PCB antenna, keep a large clearance area around the antenna and avoid placing ground/metal components in the antenna projection area.
- During production assembly, complete placement within 24 hours after unpacking (or re-dry/vacuum packaging as required by the manual).
Prodott Overview
2.1 Karatteristiċi ewlenin
Parameters Explanation
N/A BLE 6.0
Ħidma
medda ta 'frekwenza
2400~2483.5MHZ(2.4GHz ISM Band)
Antenna On-board PCB antenna
Dimensjonijiet 19 mm × 12.9 mm × 3 mm
Vol operattivtage 1.7V to 3.6V, typical value 3.3V
Launch current 5 mA@0 dBm，3.3V，Typ
Receive current 3.2 mA@1M，3.3V，Typ
Standby current 0.6 uA@3.3V，Typ
Transmit power -46 ~ +8dBm
Operazzjoni
temperatura
-40 ~ + 105℃
Ħażna
temperatura
-40 ~ + 125℃
Komunikazzjoni
Interface
UARTInternal storage 1524KB RRAM +256KB RAM
2.2 Xenarji ta' Applikazzjoni
2.4GHz low power Bluetooth system;
PCs, tablets, mobile phones, handheld devices, and other low-power peripheral
devices (HID, remote controls, etc.);
Sports, healthcare, and other consumer electronics products;
Smart meters, data collection, and other wireless sensor networks;
Photovoltaic, charging piles, industrial instruments, and other industries;
Smart home, LAN, interactive devices, beacon lights
Dijagramma tal-blokk tal-funzjoni
Dijagramma pinout
Layout requirements for the baseboard:
The PCB antenna of the module should be located at the edge of the entirebottomPCB, with a 10mm spacing around the PCB antenna. No copper, traces, or components should be placed around the antenna. If there are multiple antennas, they shouldbeplacedas far away from each other as possible to avoid interference. If components aresuggestedto be placed on the bottom board, the area around the antenna should be cut out. The recommended copper coverage size in the yellow area in the figure belowis at least 4cmx6cm.
Test points and interface solder pad description of the Bottomlayer module:
RF performance testing, there are window areas (exposed copper) on thesolder padsand some IO interfaces. No vias or exposed copper should be placed in the positions mapped to the bottom plate. Test points and unused IO interfaces should be coveredwithwhite oil to prevent short circuits. It is recommended to avoid routing or exposedcopperonthe bottom plate around the red boxed areas in the diagram below.
Figure 4.5 Position of test point solder pads on the module bottomLayout requirements for the baseboard:
The BOTTOM layer of the module has no high-speed or sensitive signal traces, but it isstill recommended to avoid routing on the TOP layer of the baseboardtopreventunexpected influences. There are not many requirements for hollowing out in the bottomplate design, exceptfor the general requirement mentioned earlier to avoid interference sources, thebottomplate can be almost fully covered with copper
Job characteristics
3.1 Power supply design
3.1.1 Interfaċċja tal-enerġija
The VCC pin is used to connect an external power supply, the interface is describedinthe table below:
Tabella 3-1 Definizzjonijiet tal-Pin tal-Provvista tal-Enerġija
Pin
numru
Pin
definizzjoni
Deskrizzjoni
Minimu
valur V
Tipiku
valur V
MaximumvalueV10 VCC Module
qawwa
1.7 3.3 3.6The module’s power supply range is 1.7~3.6V, ensuring that the operatingvoltageisnot lower than 1.7V. 3.1.2 Power supply design
The BT18N module power pins are recommended to use 10uF and 0.1uFdecouplingcapacitors. The capacitors should be placed as close as possible to the VBAT(VCC) powerpin. The power supply voltage range requirement is 1.7~3.6V, typically poweredby3.3V. Itis recommended to control the power ripple within 1% of VCC to avoid performance degradation of the module due to excessive ripple. requirements of the product during design, as shown in Table 6-1 Product AbsoluteMaximum Ratings. If higher protection requirements are needed, it is recommendedtoplace TVS diodes externally for electrostatic protection.
Nota
The reset line should not be too long, pay attention to grounding protection, andkeep away from RF, VCC power sources, and strong signal interference sources. It is recommended to reserve a 10K pull-up resistor on the RESETpinof themodule by default without soldering
Issolvi l-problemi
- Unstable module behavior or degraded performance: Ensure VCC ripple is controlled to within 1% of VCC and that the operating voltage remains within 1.7 V to 3.6 V.
- Possible crystal oscillator frequency deviation: Configure the required internal capacitor register values for the crystal oscillator (low-frequency 32.768 kHz register value stated as 14000; high-frequency 32 MHz register value stated as 15000).
- Poor RF performance / interference issues: Provide sufficient antenna clearance (do not place ground/metal in the antenna projection area) and keep interference sources at least 10 mm away from the RF part; avoid enclosing the RF part in metal cavities as much as possible.
- Reset line problems: Do not route the reset line too long; keep it away from RF, VCC power sources, and strong signal interference sources.
- Soldering defects (virtual soldering, short circuit): Follow the repair soldering parameter guidance (including lead-free vs lead craft temperatures and 5 s contact time). The manual also notes modules are not recommended to be blown with a hot air gun.
Dokumenti / Riżorsi
 | BT18N Module |
Referenzi
- Manwal għall-Utentmanual.tools